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Low temperature wafer bonding technology for RF based MEMS devices
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2013
Conference Paper
Title
Low temperature wafer bonding technology for RF based MEMS devices
Author(s)
Haubold, M.
Figur, S.
Schoenlinner, B.
Kurth, Steffen
Geßner, Thomas
Mainwork
Smart Systems Integration 2013. CD-ROM
Conference
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2013
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
