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  4. Automatic Detection of Via Arrays in AFM Images for CMP Dishing Evaluation
 
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2023
Conference Paper
Title

Automatic Detection of Via Arrays in AFM Images for CMP Dishing Evaluation

Abstract
We present an efficient algorithm for the detection of array-like patterns of circular vias in AFM images. It combines a new variant of the Hough transformation with an efficient implementation of brute-force search to ensure good results and high performance, compared to a simple intuitive approach. A set of manually labeled benchmark data is used to systematically evaluate the accuracy and improve the algorithm. We apply the new via detection method to measure dishing in AFM images of copper vias after CMP.
Author(s)
Zienert, Andreas
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Langer, Jan  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Hensel, Doreen
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Hofmann, Lutz
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Gottfried, Knut  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Schuster, Jörg  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Mainwork
IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM) 2023. Proceedings  
Conference
International Interconnect Technology Conference 2023  
Materials for Advanced Metallization Conference 2023  
DOI
10.1109/IITC/MAM57687.2023.10154637
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Keyword(s)
  • AFM

  • atomic force microscopy

  • chemical mechanical planarization

  • CMP

  • dishing

  • image processing

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