Scopus
Permanent URI for this collection
Browse
Recent Submissions
1 - 5 of 3894
-
PublicationInfluence of the Nature of Aminoalcohol on ZnO Films Formed by Sol-Gel Methods( 2023)Here we present comparative studies of: (i) the formation of ZnO thin films via the sol-gel method using zinc acetate dihydrate (ZAD), 2-methoxyethanol (ME) as solvent, and the aminoalcohols (AA): ethanolamine, (S)-(+)-2-amino-1-propanol, (S)-(+)-2-amino-3-methyl-1-butanol, 2-aminophenol, and aminobenzyl alcohol, and (ii) elemental analyses, infrared spectroscopy, X-ray diffraction, scanning electron microscopy, absorption and emission spectra of films obtained after deposition by drop coating on glass surface, and thermal treatments at 300, 400, 500 and 600 °C. The results obtained provide conclusive evidences of the influence of the AA used (aliphatic vs. aromatic) on the ink stability (prior to deposition), and on the composition, structures, morphologies, and properties of films after calcination, in particular, those due to the different substituents, H, Me, or iPr, and to the presence or the absence of a -CH2 unit. Aliphatic films, more stable and purer than aromatic ones, contained the ZnO wurtzite form for all annealing temperatures, while the cubic sphalerite (zinc-blende) form was also detected after using aromatic AAs. Films having frayed fibers or quartered layers or uniform yarns evolved to "neuron-like" patterns. UV and photoluminescence studies revealed that these AAs also affect the optical band gap, the structural defects, and photo-optical properties of the films.
-
PublicationThe Flow of Trust: A Visualization Framework to Externalize, Explore, and Explain Trust in ML Applications( 2023)We present a conceptual framework for the development of visual interactive techniques to formalize and externalize trust in machine learning (ML) workflows. Currently, trust in ML applications is an implicit process that takes place in the user-s mind. As such, there is no method of feedback or communication of trust that can be acted upon. Our framework will be instrumental in developing interactive visualization approaches that will help users to efficiently and effectively build and communicate trust in ways that fit each of the ML process stages. We formulate several research questions and directions that include: 1) a typology/taxonomy of trust objects, trust issues, and possible reasons for (mis)trust; 2) formalisms to represent trust in machine-readable form; 3) means by which users can express their state of trust by interacting with a computer system (e.g., text, drawing, marking); 4) ways in which a system can facilitate users- expression and communication of the state of trust; and 5) creation of visual interactive techniques for representation and exploration of trust over all stages of an ML pipeline.
-
PublicationInfluence of the Thermal Treatment on the Structure and Cycle Life of Copper Hexacyanoferrate for Aqueous Zinc-Ion Batteries( 2023)Copper hexacyanoferrate (CuHCF) has become an attractive Zn2+ insertion material as a positive electrode in aqueous zinc-ion batteries thanks to its high reversibility towards Zn2+ (de-)insertion, its simple, inexpensive and easily scalable synthesis route, its low toxicity, and its high working potential. It is known that the physiochemical properties of CuHCF can be modified by manipulating its synthesis parameters. However, the effect of these parameters on the material’s electrochemical performance and cycle life needs further investigation. Here, the structure and composition of CuHCF treated at different temperatures are studied through crystallographic, compositional, and thermogravimetric analyses. The resulting CuHCF powders were galvanostatically cycled to assess their electrochemical performance in relation to their annealing temperature. The results showed that the annealed CuHCF electrodes exhibited longer cycle life while maintaining a coulombic efficiency ≥ 99.5%. The longest cycle life was achieved by annealing the CuHCF electrodes at 100 °C.
-
PublicationFault Injection in Actuator Models for Testing of Automated Driving Functions( 2023)In this work, a simulation framework for virtual testing of autonomous driving functions under the influence of a fault occurring in a component is presented. The models consist of trajectory planning, motion control, models of actuator management, actuators and vehicle dynamics. Fault-handling tests in a right-turn maneuver are described, subject to an injected fault in the steering system. Different scenarios are discussed without and with a fault and without and with counteractions against the fault. The results of five scenarios for different criticality metrics are discussed. In the case of a fault without a counteraction, a pronounced lateral position deviation of the ego vehicle from the reference curve is observed. Furthermore, the minimal and hence most critical time-to-collision (TTC) and post-encroachment time (PET) values are calculated for each scenario together with a parameter variation of the initial position of a traffic agent. The minimum TTC values are lowest in the case of a fault without counteraction. For the lateral position deviation and the TTC, the counteractions cause reduced criticality that can become even lower than in the case without a fault, corresponding to a decrease in the dynamic behavior of the vehicle. For the PET, only in the case of a fault without counteraction, a non-zero value can be calculated. With the implemented testing toolchain, the automated vehicle and the reaction of the HAD function in non-standard conditions with reduced performance can be investigated. This can be used to test the influence of component faults on automated driving functions and help increase acceptance of implemented counteractions as part of the HAD function. The assessment of the situation using a combination of metrics is shown to be useful, as the different metrics can become critical in different situations.
-
PublicationDevelopment of novel single-die hybridisation processes for small-pitch pixel detectors( 2023)Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, especially for small-scale applications, such interconnect technologies need to be suitable for the assembly of single dies, typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D programme and the AIDAinnova collaboration, innovative hybridisation concepts targeting vertex-detector applications at future colliders are under development. Recent results of two novel interconnect methods for pixel pitches of 25 µm and 55 µm are presented in this contribution - an industrial fine-pitch SnAg solder bump-bonding process adapted to single-die processing using support wafers, as well as a newly developed in-house single-die interconnection process based on Anisotropic Conductive Film (ACF). The fine-pitch bump-bonding process is qualified with hybrid assemblies from a recent bonding campaign at Frauenhofer IZM. Individual CLICpix2 ASICs with 25 µm pixel pitch were bump-bonded to active-edge silicon sensors with thicknesses ranging from 50 µm to 130 µm. The device characterisation was conducted in the laboratory as well as during a beam test campaign at the CERN SPS beam-line, demonstrating an interconnect yield of about 99.7%. The ACF interconnect technology replaces the solder bumps by conductive micro-particles embedded in an epoxy film. The electro-mechanical connection between the sensor and ASIC is achieved via thermocompression of the ACF using a flip-chip device bonder. The required pixel pad topology is achieved with an in-house Electroless Nickel Immersion Gold (ENIG) plating process. This newly developed ACF hybridisation process is first qualified with the Timepix3 ASICs and sensors with 55 µm pixel pitch. The technology can be also used for ASIC-PCB/FPC integration, replacing wire bonding or large-pitch solder bumping techniques. This contribution introduces the two interconnect processes and presents preliminary hybridisation results with CLICpix2 and Timepix3 sensors and ASICs.