Microring resonators fabrication by BCB adhesive wafer bonding

Microring resonator devices are attractive for Wavelength Division Multiplexing (WDM) applications because of their inherent spectral characteristics. GaInAsP/InP microring resonator devices were fabricated using a vertical integration concept based on GaInAsP/InP-on-GaAs wafer-to-wafer bonding. Different materials and wafer bonding processes were tested. The successful fabrication process was using BCB wafer-to-wafer adhesive bonding.