Title

Semiconductor Wafer Bonding 10. Science, Technology, and Applications

Title Supplement

Tenth International Symposium on Semiconductor Wafer Bonding; Honolulu, Hawaii, on October 14-16, 2008

Person Involved

Corporate Author

Electrochemical Society -ECS-, Electronics and Photonics Division

Publisher

Publishing Place

Pennington

Publication Date

2008

Series

ECS transactions; 16,8

ISSN

1938-5862

ISBN

978-1-56677-654-7

978-1-60768-007-9

Conference

DDC

660