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Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders
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2005
Conference Paper
Title
Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders
Author(s)
Déplanque, S.
Nüchter, W.
Spraul, M.
Wunderle, B.
Dudek, R.
Michel, B.
Mainwork
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2005
Conference
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 2005
DOI
10.1109/ESIME.2005.1502777
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
