Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2005
Titel Supplements
Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, April 18, 19, 20, 2005, Radisson Hotel, Berlin, Germany
Institut
IEEE Components, Packaging, and Manufacturing Technology Society