Title

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2005

Title Supplement

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, April 18, 19, 20, 2005, Radisson Hotel, Berlin, Germany

Person Involved

Corporate Author

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

IEEE Order Department

Publishing Place

Piscataway, NJ

Publication Date

2005

ISBN

0-7803-9062-8

0-7803-9063-6

Conference

International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 2005

Options

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2005