Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination

An investigation of interfacial interaction has been performed between an industry oriented epoxy molding compound Epoxy Phenol Novolac (EPN) and its filled variety EPNF (with silica particles) and a native silicon dioxide layer (SiO2) usually found at chip surfaces. The free surfaces of both solid materials were experimentally analysed by contact angle measurements of three different liquids (water, methylene-iodide (MI) and glycerol). Results are compared to interfacial energies obtained by analysis of the interfaces in bimaterial molecular models, yielding reasonable agreement. A qualitative prediction regarding the influence of water on the interfacial strength between chip and molding compound is attempted.