Title

12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011

Title Supplement

Linz, Austria, 18 - 20 April 2011

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

New York, NY

Publication Date

2011

ISBN

978-1-4577-0107-8

978-1-4577-0106-1

Conference