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EIS applications in packaging. Evaluation of the sealing layer quality of aluminium lids by AC/DC/AC-test routines in combination with surface-EIS (SEIS) and cut-edge-delamination
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2001
Conference Paper
Title
EIS applications in packaging. Evaluation of the sealing layer quality of aluminium lids by AC/DC/AC-test routines in combination with surface-EIS (SEIS) and cut-edge-delamination
Author(s)
Hollaender, J.
Mainwork
EIS2001. 5th International Symposium on Electrochemical Impedance Spectroscopy
Conference
International Symposium on Electrochemical Impedance Spectroscopy -EIS-
Language
English
Fraunhofer-Institut für Verfahrenstechnik und Verpackung IVV