Via-last technology for the interconnection of flash and processor chip for mobile applications

2013

Conference Paper

Author(s)

Puschmann, R.

Böttcher, M.

John, P.

Bartussek, I.

Manier, C.

Zoschke, K.

Grafe, J.

Ziesmann, M.

Mainwork

Smart Systems Integration 2013. CD-ROM

Conference

International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2013