3D Multilayered Ceramics - harsh environment interposer technologies expand into 3rd dimension

Ziesche, Steffen; Lenz, Christian; Müller-Köhn, Axel; Scheithauer, Uwe; Partsch, Uwe

doi:10.1109/ESTC.2018.8546387

2018

Conference Paper

Abstract

The contribution deals with technologies to transform conventional planar ceramic interposers like thick film and multilayer ceramic substrates into functional 3D geometries comparable to polymer based Molded Interconnect Devices (MID). Different technological approaches like folding, cold and hot Embossing, Ceramic Injection Moulding and Additive Manufacturing are discussed.