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  4. Aqueous fluoride residue removers for 32 nm and beyond copper ultra low-K technologies
 
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2012
Conference Paper
Title

Aqueous fluoride residue removers for 32 nm and beyond copper ultra low-K technologies

Abstract
Mallinckrodt Baker, Inc. (MBI) has developed an aqueous fluoride-based cleaner (AFC1) that shows improved ultra-low k (ULK) and cobalt tungsten phosphide (CoWP) compatibility over dilute hydrofluoric acid (dHF) and a simple solvent based cleaner (SFC1). Performance and compatibility testing was performed with beaker tests at MBI and on 45 nm wafers by GLOBALFOUNDRIES. Our results indicate that AFC1 may be a good alternative to dHF for future Cu technologies.
Author(s)
Westwood, G.
Pigliucci, A.
Oszinda, T.
Leppack, S.
Schaller, M.
Mainwork
Ultra clean processing of semiconductor surfaces X  
Conference
International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) 2010  
DOI
10.4028/www.scientific.net/SSP.187.249
Language
English
CNT  
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