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  4. Studies on the reliability of power packages based on strength and fracture criteria
 
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2011
Conference Paper
Title

Studies on the reliability of power packages based on strength and fracture criteria

Abstract
Thermal cycling induced failure in power packages has been studied comparing thermal cycling (TC) with thermal shock (TS) tests by thermo-mechanical analyses. The major question for the time reduction is that after the failure mechanism and if it changes with changed loading type and duration. These questions were addressed by theoretical analyses including coupled transient thermal-mechanical analyses and interface fracture mechanics applying the cohesive zone approach. By the latter, critical states for delamination failures could be derived. Finally, critical interface fracture parameters of the package were compared with results from the button shear test.
Author(s)
Dudek, Rainer  
Pufall, R.
Seiler, B.
Michel, Bernd  
Mainwork
12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011  
Conference
International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2011  
DOI
10.1109/ESIME.2011.5765810
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
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