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Capabilities of an ambient pressure plasma for activation in LT wafer bonding processes
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2005
Conference Paper
Title
Capabilities of an ambient pressure plasma for activation in LT wafer bonding processes
Author(s)
Gabriel, M.
Cetin, V.
Hansen, S.
Reiche, M.
Radu, I.
Eichler, M.
Mainwork
Semiconductor wafer bonding VIII. Science, technology, and applications
Conference
International Symposium on Semiconductor Wafer Bonding - Science, Technology, and Applications 2005
Electrochemical Society (Spring Meeting) 2005
Language
English
Fraunhofer-Institut für Schicht- und Oberflächentechnik IST
