Title

Semiconductor wafer bonding VIII. Science, technology, and applications

Title Supplement
Proceedings of the international symposium; Eighth International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, held in May 2005 in Quebec City, Canada, as part of the 2005 spring meeting of the Electrochemical Society
Person Involved
Corporate Author
Electrochemical Society -ECS-, Electronics Division
Publisher
Publishing Place
Pennington
Publication Date
2005
Series
Electrochemical Society. Proceedings; 2005-2
ISBN
1-566-77460-8
Conference