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Miniaturized frequency doubled DPSS assembled using solderjet bumping technology
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2013
Conference Paper
Title
Miniaturized frequency doubled DPSS assembled using solderjet bumping technology
Author(s)
Guilhot, Denis A.
Gilaberte, M.
Ferrando, Sara
Ribes, P.
Montes, D.
Galan, M.
Burkhardt, Thomas
Beckert, Erik
Hornaff, Marcel
Mainwork
Smart Systems Integration 2013. CD-ROM
Conference
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2013
Language
English
Fraunhofer-Institut für Angewandte Optik und Feinmechanik IOF
