Wafer-level glass capping with optical integration

A previously described wafer-level packaging (WLP) process allows quasi-hermetic capping of optical devices on wafer level yielding miniaturized glass cavity windows on top of the optical area - at the same time leaving the contact area accessible for standard electrical connections i.e. wire bond. This paper will focus on advancements in integrating coatings, apertures and three-dimensional lensstructures to achieve a functional integration of a packaging technology with optical qualities. The elevated requirements on the used technologies are discussed and shown on a manufactured demonstrator.