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Title
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
Title Supplement
Seville, Spain, 5-7 May 2010; including the Conference on CAD, Design and Test and the Conference on Microfabrication, Integration and Packaging
Person Involved
Corporate Author
IEEE Components, Packaging, and Manufacturing Technology Society
Circuits Multi-Projets -CMP-, Grenoble
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2010
ISBN
978-1-4244-6636-8
978-2-35500-011-9