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Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
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Title
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
Titel Supplements
Seville, Spain, 5-7 May 2010; including the Conference on CAD, Design and Test and the Conference on Microfabrication, Integration and Packaging
Institut
IEEE Components, Packaging, and Manufacturing Technology Society
Circuits Multi-Projets -CMP-, Grenoble
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2010
Konferenz
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 2010
Conference on CAD, Design and Test 2010
Conference on Microfabrication, Integration and Packaging 2009