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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Modular Ultra-Low-Power IoT-Core - Bridging the Gap Between Power Electronics and Distributed Sensor Networks
Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Miniaturization of power converters by piezoelectric transformers - chances and challenges
Fraunhofer cluster 3D integration - key to a holistic technology and service approach
HBM and ASIC silicon interposer
Energy harvesting and conversion - applications of piezoelectric transformer and transducer MEMS
Interposer-based smartcard system with active wireless communication
Very-Thin System-in-Package Technology for Structural Analysis
Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Entwurfsmethoden für verbesserte robuste Batteriemanagementsysteme. Teilvorhaben