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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Wafer Level Capping Technology for Vacuum Packaging of Microbolometers
Finite Element-Based Monitoring of Solder Degradation in Discrete SiC MOSFETs
Structural Integration of Smart Sensors for the Industrial Internet of Things
Modification of Prony Series Coefficients to Account for Thermo-Oxidative Ageing Effects within Numerical Simulations
Determination of Lemaitre Damage Parameters for Al H11 Wire Material
Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate
On-chip integration of optical microbottles for biosensing
A Closer Look to Fan-out Panel Level Packaging
TSiCV Based Silicon Carbide Interposer Technology
Warpage of Fan-Out Panel Level Packaging - Experimental and Numerical Study of Geometry and Process Influence