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  4. Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate
 
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2023
Conference Paper
Title

Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate

Abstract
The thermo-mechanical robustness of Advanced Driving Assistance Systems is crucial to leverage the growing market of automated driving. Especially in case of optical sensors, such as camera and Light Detection and Ranging (LiDAR) sensors, the thermo-mechanical state of the sensor front end is closely coupled with its optical performance. Deformations in the optical path, consisting of the lens elements and imager, can cause major performance degradation like defocus. Additionally, the big Coefficient of Thermal Expansion (CTE) mismatch between the commonly used FR4 substrate and large silicon (time-offlight) imagers, leads to extraordinary mechanical stress in the respective interconnects if operated under harsh automotive temperature conditions. Hence, within this work, an optical LiDAR front end on glass is realized in the form of reducedcomplexity modules (RCMs) of the transmitter and receiver path. The transmitter RCM, consisting of a variety of small glassmounted high power Vertical Cavity Surface Emitting Laser (VCSEL) diodes is tested and evaluated with respect to lifetime reliability, whereas the receiver RCM, consisting of a glassmounted large-scale imager, is firstly investigated with regard to cooling under high temperature operation.
Author(s)
Kettelgerdes, Marcel
Fraunhofer-Institut für Verkehrs- und Infrastruktursysteme IVI  
Mezmer, Peter
Technische Universität Chemnitz  
Häußler, Michael Johannes
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Böttger, Gunnar  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Tavakolibasti, Majid
Technische Universität Chemnitz  
Pandey, Amit
Technische Hochschule Ingolstadt
Erdogan, Hüseyin
Conti Temic microelectronic GmbH
Elger, Gordon  
Fraunhofer-Institut für Verkehrs- und Infrastruktursysteme IVI  
Schacht, Ralph
Brandenburgische Technische Universität Cottbus-Senftenberg
Wunderle, Bernhard
Chemnitz University of Technology
Mainwork
IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Proceedings  
Project(s)
Miniaturisierte LIDAR-Sensoren mit KI-Zustandsüberwachung für das autonome Fahren  
Funder
Bundesministerium für Bildung und Forschung -BMBF-  
Conference
Electronic Components and Technology Conference 2023  
DOI
10.1109/ECTC51909.2023.00131
Language
English
Fraunhofer-Institut für Verkehrs- und Infrastruktursysteme IVI  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • LiDAR

  • reliability

  • thermo-mechanical simulation

  • optical simulation

  • glass packaging

  • VCSEL

  • lifetime testing

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