Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
    ( 2018)
    Rülke, Steffen
    ;
    Beyer, Volkhard
    ;
    Zorn, Wolfgang
    ;
    Meinig, Marco
    ;
    Wecker, Julia
    ;
    Reuter, Danny
    ;
    Deicke, Frank
    ;
    Clausner, André
    ;
    Werner, Thomas
    Functional integration on the micro/nano scales enables smart functionalities in mechanical engineering systems. Here, exemplarily shown for a ball screw drive, a structure-integrated wireless sensor technology is implemented into a manufacturing system for advanced process control and status monitoring - even at machine components being not yet accessible or difficult to access. This includes also a miniaturized, networked and energy-efficient information and communication technology (ICT) integrated into the machine.
  • Publication
    Fraunhofer cluster 3D integration - key to a holistic technology and service approach
    ( 2014)
    Wolf, Jürgen M.
    ;
    Schulz, Stefan
    ;
    Schneider, Peter
    ;
    Zschech, Ehrenfried
    3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IIS-EAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. The complex correlation of the different aspects of 3D integration and the synergies that are met by the Fraunhofer cluster enable a strong positioning as a competent and broad project, technology and service partner.
  • Publication
    Fraunhofer cluster 3D integration
    ( 2014)
    Wolf, M. Jürgen
    ;
    Schulz, Stefan
    ;
    Schneider, Peter
    ;
    Zschech, Ehrenfried
    3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IISEAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. This supports the strengthening of Germany as a center of innovation and economy and its leading role as a driver for innovative products in the field of microelectronic system integration. The presentation will show the complex correlation of the different aspects of 3D integration and demonstrate the synergies that are met by the new Fraunhofer cluster and that enable the positioning as a competent and broad project, technology and service partner for industrial clients.