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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique
On the crack and delamination risk optimization of a Si-interposer for LED packaging
Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
On the crack and delamination risk optimization of a Si-interposer for LED packaging
Reliability analysis of low temperature low pressure Ag-sinter die attach
Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks