Options
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
On the crack and delamination risk optimization of a Si-interposer for LED packaging
Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique
Comparative study of residual stress measurement techniques with high spatial resolution
Verfahren und Vorrichtung zur thermischen Ueberwachung von Ausfallprozessen
Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials
Localized high-resolution stress measurements on MEMS structures
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
Advanced virtual qualification methods to reduce the time-to-market of microelectronic assemblies
Simulation based analysis of secondary effects on solder fatigue