Advanced virtual qualification methods to reduce the time-to-market of microelectronic assemblies

This work presents some recent progresses in reliability assessment of electronic assemblies in automotive industry and shows how coupled numerical-experimental techniques can help save time and reduce the cost of IC package qualification. In order to fulfill the continuous trends in miniaturization of the electronic devices together with the demand to shorten the time to market, it is essential to use virtual qualification methods with the simulation tools. One of the main concerns in electronic packages is the structural integrity during their fabrication, surface mount process, and service life. A prominent example of failure in electronic assemblies is the interface delamination between two dissimilar materials. This failure mode is accelerated when the polymeric materials absorb moisture from humid environments. Moisture results in degradation of the physical properties of polymers, induces additional deformation due to hygroscopic swelling, and more importantly, d egrades the adhesion strength of the polymer to metal joints.