Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Patent
    Chipmodul sowie Verfahren zur Herstellung eines Chipmoduls
    ( 2002)
    Oppermann, H.H.
    ;
    Zakel, E.
    ;
    Azdasht, G.
    ;
    Kasulke, P.
    The chip module (20) has at least one chip (22) attached to a chip carrier (21) provided by a foil and a plastics carrier layer (23), providing a conductor path structure (24) with conductor paths (28) connected to corresponding contact pads (32) of the chip on the front side and provided with external contact regions (26) on the rear side, for connection to a circuit board substrate (31). The external contact regions are provided by openings in the carrier layer of the chip carrier at the rear side of the conductor paths, aligned with terminal pads (30) for the chip provided by the circuit board substrate. USE - For chip-scale package. ADVANTAGE - Simple manufacture of chip module with reduced number of individual steps.
  • Patent
    Verbindungsstruktur
    ( 2002)
    Azdasht, G.
    ;
    Kasulke, P.
    ;
    Badrihafifekr, H.
    ;
    Weiss, S.
    ;
    Zakel, E.
    The components are of materials of different expansion coeffts., and at least one component is an electric power element. High melting material are used for connection structure, forming individual connection elements (29) between the contact faces (27,28) of the component elements (21,22). Preferably each connection element is made of a single material and directly coupled to the contact faces. Typically as a laminated structure. The connection elements may contain an intermediate layer of a soldering material for contacting the opposite contact faces. USE/ADVANTAGE - For electronic power elements, such as laser diodes etc. Reliable reduction of thermally induced stresses without impairing the component service life.
  • Patent
    Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
    ( 2001)
    Aschenbrenner, R.
    ;
    Ansorge, F.
    ;
    Zakel, E.
    ;
    Kasulke, P.
    The production of a novel, non-contact smart card (1) is claimed. The electrically-insulating, flat card is made with at least one recess(es) on one side. Conductive track(s) are applied in a given pattern, on the surface of the recessed side. The track(s) are applied on surfaces both within and outside the recess(es). Microcircuit chip(s) (4) are aligned in the recess(es) and brought into contact with the track(s). Also claimed is a contact-less smart card, essentially as described. USE - Used to make a contact-less smart card with potentially extremely wide application in private and public life. ADVANTAGE - The process manufactures non-contact smart cards, producing the coils especially, at low cost. Resistance to mechanical stress and reliability are good. Single stage processes are employed where possible. Hot Stamp coil application is particularly economic and adhesive on the coil underside completes attachment. High production rates are achieved. The coil transfers data and/or e nergy, acting as an antenna. Of various applicable mounting technologies, the flip-chip method is particularly compact. Contact bumps are conveniently and accurately formed and registered during the earlier hot-stamping stage. Hermetic sealing using glob top technology, increases the reliable life of the card.
  • Patent
    Vorrichtung zur Beaufschlagung eines Drahtendes in einer Drahtbondeinrichtung mit einem Schutzmedium
    ( 1999)
    Jung, E.
    ;
    Kasulke, P.
    ;
    Zakel, E.
    The applicator is intended for treatment of a wire end brought out from a bonding capillary. The bonding wire end (13) is engaged by the medium from a flow applicator device (26), which is preferably mobile, at least partly, such that it can carry out a to-and-fro motion with respect to the bonding wire (12) displacement path. Typically the flow applicator device comprises two partial devices (28,29) spaced on a common flow axis (40) to form an intermediate chamber. The bonding device (25) may contain a flame remover (30), movable along the applicator axis and locating with the partial device (5). USE/ADVANTAGE - For ball-wedge wire bonding device for coupling terminals of one or more substrates. Simple maintenance and removal of operational failures.
  • Patent
    Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
    ( 1999)
    Aschenbrenner, R.
    ;
    Ansorge, F.
    ;
    Zakel, E.
    ;
    Kasulke, P.
    The method involves arranging an electrically conductive coil (2) on the surface of an insulating card (1). One or more non-packaged chips (4) are aligned in openings on the card surface. The electrical connections between the chip contacts and the coil contacts on the card surface are fabricated using flip-chip techniques. The card has openings may be made by injection moulding. The card body may be made of a thermoplastic material such as PVC, ABS or polycarbonate. USE - E.g. for telecommunication and identification, for insurance cards, patient data cards, emergency cards, credit cards or pay TV cards. ADVANTAGE - Provides good mechanical robustness and reliability.
  • Patent
    Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten
    ( 1999)
    Zakel, E.
    ;
    Ansorge, F.
    ;
    Kasulke, P.
    ;
    Ostmann, A.
    ;
    Aschenbrenner, R.
    ;
    Dietrich, L.
  • Patent
    Verfahren zum Anbringen eines Bauelements an einem plattenfoermigen Traeger
    ( 1998)
    Azdasht, G.
    ;
    Kasulke, P.
    The component mounting method is used for attaching an electronic component (10) to the surface of a carrier plate (12,18), with a solder layer inserted between the component and the carrier plate surface. An optical fibre or optical fibre bundle is applied to the opposite side of the carrier plate and supplied with a laser light pulse provided for melting the solder layer, to provide a mechanical and electrical connection between the component and the carrier plate. USE - For attaching laser diode to Cu coated circuit board. ADVANTAGE - Reduced thermic loading of electronic component.
  • Patent
    Verfahren zur Ausbildung einer raeumlichen Chipanordnung und raeumliche Chipanordung
    ( 1998)
    Oppermann, H.H.
    ;
    Azdasht, G.
    ;
    Kasulke, P.
    ;
    Zakel, E.
  • Patent
    Herstellung galvanisch/stromlos gestalteter Kontakthoecker
    ( 1997)
    Aschenbrenner, R.
    ;
    Ostmann, A.
    ;
    Zakel, E.
    ;
    Kasulke, P.
  • Patent
    Verfahren zur Herstellung einer Durchkontaktierung sowie Chiptraeger und Chiptraegeranordnung mit einer Durchkontaktierung
    ( 1997)
    Azdasht, G.
    ;
    Kloeser, J.
    ;
    Kasulke, P.
    The method involves providing a deformable substrate (11) and using a form tool (15). The substrate has a polyimide film (12) sandwiched between two metallised layers (13,14), e.g. of copper. During production, the metallisation layers are simultaneously pressed by displacement of the substrate. The substrate is displaced in a process involving pressure and temperature using the form tool and e.g. application of e.g. current, laser radiation, or ultrasound, the through contact is formed. USE/ADVANTAGE - For multi-layer technology, multi-grid array, and ball-grid array. Permits cheap formation of through-contact with substrate. Provides chip carrier arrangement using substrate preparation with reduced expenditure.