• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Patente
  4. Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
 
  • Details
Options
Patent
Title

Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte

Other Title
Contactless chip-card manufacture method - using flip-chip technique to make connections between chip contacts and coil contacts on card surface.
Abstract
The method involves arranging an electrically conductive coil (2) on the surface of an insulating card (1). One or more non-packaged chips (4) are aligned in openings on the card surface. The electrical connections between the chip contacts and the coil contacts on the card surface are fabricated using flip-chip techniques. The card has openings may be made by injection moulding. The card body may be made of a thermoplastic material such as PVC, ABS or polycarbonate. USE - E.g. for telecommunication and identification, for insurance cards, patient data cards, emergency cards, credit cards or pay TV cards. ADVANTAGE - Provides good mechanical robustness and reliability.
Inventor(s)
Aschenbrenner, R.
Ansorge, F.
Zakel, E.
Kasulke, P.
Link to:
Espacenet
Patent Number
1997-19732353
Publication Date
1999
Language
German
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024