Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Patent
    Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
    ( 2001)
    Aschenbrenner, R.
    ;
    Ansorge, F.
    ;
    Zakel, E.
    ;
    Kasulke, P.
    The production of a novel, non-contact smart card (1) is claimed. The electrically-insulating, flat card is made with at least one recess(es) on one side. Conductive track(s) are applied in a given pattern, on the surface of the recessed side. The track(s) are applied on surfaces both within and outside the recess(es). Microcircuit chip(s) (4) are aligned in the recess(es) and brought into contact with the track(s). Also claimed is a contact-less smart card, essentially as described. USE - Used to make a contact-less smart card with potentially extremely wide application in private and public life. ADVANTAGE - The process manufactures non-contact smart cards, producing the coils especially, at low cost. Resistance to mechanical stress and reliability are good. Single stage processes are employed where possible. Hot Stamp coil application is particularly economic and adhesive on the coil underside completes attachment. High production rates are achieved. The coil transfers data and/or e nergy, acting as an antenna. Of various applicable mounting technologies, the flip-chip method is particularly compact. Contact bumps are conveniently and accurately formed and registered during the earlier hot-stamping stage. Hermetic sealing using glob top technology, increases the reliable life of the card.
  • Patent
    Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten
    ( 1999)
    Zakel, E.
    ;
    Ansorge, F.
    ;
    Kasulke, P.
    ;
    Ostmann, A.
    ;
    Aschenbrenner, R.
    ;
    Dietrich, L.
  • Patent
    Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
    ( 1999)
    Aschenbrenner, R.
    ;
    Ansorge, F.
    ;
    Zakel, E.
    ;
    Kasulke, P.
    The method involves arranging an electrically conductive coil (2) on the surface of an insulating card (1). One or more non-packaged chips (4) are aligned in openings on the card surface. The electrical connections between the chip contacts and the coil contacts on the card surface are fabricated using flip-chip techniques. The card has openings may be made by injection moulding. The card body may be made of a thermoplastic material such as PVC, ABS or polycarbonate. USE - E.g. for telecommunication and identification, for insurance cards, patient data cards, emergency cards, credit cards or pay TV cards. ADVANTAGE - Provides good mechanical robustness and reliability.
  • Patent
    Herstellung galvanisch/stromlos gestalteter Kontakthoecker
    ( 1997)
    Aschenbrenner, R.
    ;
    Ostmann, A.
    ;
    Zakel, E.
    ;
    Kasulke, P.
  • Patent
    Herstellung galvanisch abgeformter Kontakthoecker
    ( 1997)
    Aschenbrenner, R.
    ;
    Ostmann, A.
    ;
    Zakel, E.
    ;
    Kasulke, P.
    The contact bumps are intended for the bottom of integrated circuits, the metal deposition is formed on a metallising subsequently located under the contact bump, using external current-free process. Preferably an Ni or Au deposition is carried out on the metal bond pad, typically of Al, as an under-bump metallising, prior to depositing a thin plating base (5) in an external current-free process, the metal of the plating base is to be so selected that there is no permanent diffusion between under-metallising and metal contact bumps. USE/ADVANTAGE - For flip-chip or TAB technique, without need for high cost sputtering.