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2012
Conference Proceeding
Title

ICPT 2012, International Conference on Planarization/CMP Technology. Proceedings

Title Supplement
October 15 - 17, 2012, Grenoble, France
Abstract
As the result of increased co-operation between local CMP users groups in Europe, Japan, Korea, Taiwan, and the United States of America, the International Conference on Planarization/CMP Technology ICPT has been established as the most respected annual gathering on this topic. The ICPT program 2012 covers the following topical interests - front-end dielectrics - front-end metals - equipment, endpoint and control - 3D, TSV & MEMS - consumables metrology - fundamentals - new CMP applications - consumables
Person Involved
Zwicker, G.
Corporate Author
Fraunhofer-Institut für Siliziumtechnologie -ISIT-, Itzehoe
VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-
Publisher
VDE-Verlag  
Publishing Place
Berlin
Conference
International Conference on Planarization/CMP Technology (ICPT) 2012  
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT  
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