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  4. Data Retention in co-doped HZO FeCAPs: Roles of FE Thickness and Thermal Budget
 
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2025
Conference Paper
Title

Data Retention in co-doped HZO FeCAPs: Roles of FE Thickness and Thermal Budget

Abstract
This study investigates data retention (DR) in co-doped Hafnium Zirconium Oxide (HZO) ferroelectric capacitors (FeCAPs) under high-temperature stress. Imprint, due to charge injection at an metal/ferroelectric (M/FE) interface, impacts DR, especially in opposite-state retention. The vulnerability to imprint is shown to be mitigated by high annealing temperature (>600∘C), operations under high program electric fields (≃4MV/cm), and thick FE layer (tFE≃15 nm). Two samples demonstrated DR exceeding 1000 hours at 125∘C, with a model suggesting DR for over 10 years for the optimally annealed samples, supporting FeCAP in high-temperature applications.
Author(s)
Barbot, Justine
X-FAB Global Services GmbH
Peller, Markus
X-FAB Dresden GmbH and Co. KG
Robert, Isaac Emanuel
X-FAB Dresden GmbH and Co. KG
Bernert, Kerstin
X-FAB Dresden GmbH and Co. KG
Mähne, Hannes
X-FAB Dresden GmbH and Co. KG
Thiem, Steffen
X-FAB Dresden GmbH and Co. KG
Lehninger, David
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Sünbül, Ayse
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Seidel, Konrad  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Kämpfe, Thomas  orcid-logo
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Mainwork
Shaping the future with innovations in devices and manufacturing  
Conference
Electron Devices Technology and Manufacturing Conference 2025  
DOI
10.1109/EDTM61175.2025.11040648
Language
English
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Keyword(s)
  • Data Retention

  • FeCAP

  • Hafnium Oxide

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