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  4. Towards Scalable 3D Integration of 2T-nC FeRAM with Hundreds of Layer Stacking
 
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2025
Conference Paper
Title

Towards Scalable 3D Integration of 2T-nC FeRAM with Hundreds of Layer Stacking

Abstract
In this work, we study the limits of the number of capacitors and read history dependence in a 2T-nC ferroelectric random-access memory (FeRAM) cell, paving the way for its high-density integration toward hundreds of stacked layers. Through a comprehensive experimental and simulation study on the scaling behavior of the 2T-nC FeRAM architecture, we demonstrate: (i) successful fabrication of 2T-64C cells with robust memory operation and clearly distinguishable '0' and '1' states, even in 64-capacitor configurations; (ii) that the parasitic capacitance of the floating node originates predominantly from the linear component of the ferroelectric capacitor, and its impact on n-scaling - due to degraded sense margin - can be mitigated by floating unselected capacitors with enough TΩ isolation; (iii) that sharing write and read transistors among n capacitors introduces a read history dependence issue due to fluctuating floating node voltage (V<inf>FN</inf>); and (iv) that a proposed FN discharge scheme can effectively eliminate read-sequence dependence, at the cost of reduced read endurance.
Author(s)
Duan, Jiahui
University of Notre Dame
Deng, Shan
University of Notre Dame
Biswas, Rudra
Pennsylvania State University
Tauki, Sadik Yasir
Pennsylvania State University
Ma, Sizhe
University of Notre Dame
Joshi, Rajiv V.
IBM Thomas J. Watson Research Center
Kämpfe, Thomas  orcid-logo
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Gong, Xiao
National University of Singapore
Narayanan, Vijaykrishnan
Pennsylvania State University
Ni, Kai
University of Notre Dame
Mainwork
IEEE International Electron Devices Meeting, IEDM 2025  
Conference
International Electron Devices Meeting 2025  
DOI
10.1109/IEDM50572.2025.11353513
Language
English
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
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