Modelling-Augmented Failure Diagnostics in Planar SiC MOS Devices Using TDDB Measurements

In this study we analyzed the physical mechanisms governing time-dependent dielectric breakdown (TDDB) and we used TDDB physical model of dielectric breakdown, implemented in the defect-centric Ginestra® modeling platform, to deconvolute the intrinsic material properties effects and geometry feature impact on the gate oxide (GOx) and SiC-device breakdown.