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2023
Conference Paper
Title
Double-sided measurement of defect density on through-structured wafers before wafer level bonding
Abstract
In this paper we present a method for double-sided measurement of defect density on through-structured 200 mm silicon wafers. The detection of the defects is carried out using a standard microscope in the dark-field mode, using a wafer-edge handling system. An automatic pattern recognition locates and quantifies the defects based on the acquired images.
Author(s)
Mainwork
Mikrosystemtechnik Kongress 2023 Mikroelektronik Mikrosystemtechnik Und Ihre Anwendungen Nachhaltigkeit Und Technologiesouveranitat Proceedings
Conference
MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat MicroSystems Technology Congress 2023: Microelectronics, Microsystems Technology and their Applications - Sustainability and Technology Sovereignty