Bonding wire characterization using non-destructive X-ray imaging

Counterfeiting in the semiconductor industry poses a significant threat to the economy and can lead to lower performance and reliability of electronic devices. X-ray technology in this respect is commonly used for non-destructive testing to identify physical defects and anomalies in integrated circuits. However, for accurate material identification, destructive methods such as spectroscopic techniques including X-ray diffraction and X-ray fluorescence are typically required. In this work, a fast and non-destructive method is presented for material characterization of bonding wires in ICs and other SMD components by measuring X-ray absorption profiles. The results demonstrated that the X-ray imaging technique can effectively distinguish between bonding wires made of gold, silver, copper, and aluminum. Moreover, the thickness of these materials can also be detected. This technique exhibits high potential for utilization as a simple and quick method for non-destructive material characterization in the industrial environment.