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2021
Conference Paper
Title
A Generic Approach for Automatic Design Rule Derivation for Assembly Design Kits (ADK)
Abstract
There is a rising demand for advanced packaging solutions to cover certain aspects for an integration into application cases. This results in a large offering of different technologies for packaging and in this different technologies even more variants can be setup. And it is also possible to combine different package technologies to create new solutions like a package-on-package. To cope with the rising number and the speed of advances it is a necessity to have a fast way of deriving design rules for package technologies to enable fast market entry and early usage by customers. This abstract covers a generic approach for an automatic design rules derivation for assembly design kits (ADK).The process starts with the design phase. Based on an initial specification of the package technologies generic measurement structures are automatically generated covering key aspects of the technology. For example the first picture depicts parts of the generated structures for an advanced organic package substrate. These structures comprise variations for different line width and line space combinations in conjunction with their neighborhood and orientation. After manufacturing of the substrate these patterns are automatically measured using e.g. wafer probing equipment. This can be seen on the next picture. Every of this structure is approached by probes and measurement are run and collected. After running all measurements for different manufacturing samples the results cover a good overview of which structures show an behavior within specification and structures with fails. Based on an evaluation of the results, design rules are derived and automatically fitted to a set of design rules for standard design rule checking tools. Afterwards these set of design rules are collected in an ADK and can be made available for internal usage or for external customers.
Mainwork
2021 IEEE 23rd Electronics Packaging Technology Conference EPTC 2021
Conference
23rd IEEE Electronics Packaging Technology Conference, EPTC 2021