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  4. Higher Order Thermal Impedance Extraction of GaN Power HEMTs by I – V Measurements
 
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2025
Journal Article
Title

Higher Order Thermal Impedance Extraction of GaN Power HEMTs by I – V Measurements

Abstract
This work presents a method for extracting higher order thermal models of GaN power high-electron mobility transistors (HEMTs) from I–V measurements using a typical commercial power analyzer. The approach involves deriving and fitting an electrothermal model func tion to measure data using a nonlinear least
quares solver, yielding the thermal parameters for a higher order thermal model. Measurements are conducted using a parameter analyzer and a controlled thermal chuck, with a transient drain current response signal. The method is employed to derive the thermal impedance parameters of a 5th-order thermal Foster model for a GaN power transistor. The Foster model parameters are presented in both time and frequency domains and are subsequently transformed into
Cauer model parameters. The results demonstrate strong agreement with data obtained from an on-chip temperature sensor, confirming the method’s validity. This new extrac tion method can be executed using standard laboratory equipment typically available for the electrical characteri zation of GaN power transistors.
Author(s)
Reiner, Richard  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Nambiar, Akshay Gangadharan
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Mönch, Stefan  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Basler, Michael  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Grieshaber, Daniel  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Waltereit, Patrick  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Döring, Philipp
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Quay, Rüdiger  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Journal
IEEE transactions on electron devices  
Open Access
DOI
10.1109/TED.2025.3539594
10.24406/publica-4637
File(s)
TransED_2025_Reiner.pdf (3.03 MB)
Rights
CC BY 4.0: Creative Commons Attribution
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • Channel temperature

  • electrothermal model

  • high-electron mobility transistor (HEMT)

  • junction temperature

  • linear region

  • pulsed measurement

  • self heating

  • thermal impedance

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