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  4. Analyzing the Conduction Mechanism and TDDB Reliability of Antiferroelectric-like MIM Capacitors
 
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2023
Conference Paper
Title

Analyzing the Conduction Mechanism and TDDB Reliability of Antiferroelectric-like MIM Capacitors

Abstract
Antiferroelectric-like capacitors are of high interest for on-chip energy storage. This paper studies the conduction mechanisms of antiferroelectric-like aluminum doped hafnium oxide metal-insulator-metal 3-dimensional capacitors in order to select an appropriate lifetime extrapolation model for TDDB measurement data by verifying the model parameters. These capacitors are tested for Generalized Trap-Assisted Tunneling conduction mechanisms through two different leakage current experiments. An appropriate lifetime extrapolation model is selected from the conduction mechanisms, by introducing a novel analysis method and parameter extraction.
Author(s)
Viegas, Alison Erlene
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Everding, Maximilian
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Falidas, Konstantinos Efstathios  orcid-logo
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Lederer, Maximilian
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Czernohrosky, Malte
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Heitmann, Johannes
TU Bergakademie Freiberg
Mainwork
IEEE International Integrated Reliability Workshop, IIRW 2023  
Conference
International Integrated Reliability Workshop 2023  
DOI
10.1109/IIRW59383.2023.10477698
Language
English
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Fraunhofer Group
Fraunhofer-Verbund Mikroelektronik  
Keyword(s)
  • antiferroelectric

  • MIM capacitors

  • TDDB

  • TAT

  • leakage

  • conduction mechanism

  • HfO2

  • 3D Capacitors

  • Extrapolation

  • Hafnium oxide

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