• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. A 4H-SiC CMOS Technology enabling Smart Sensor Integration and Circuit Operation above 500 °C
 
  • Details
  • Full
Options
April 16, 2024
Conference Paper
Title

A 4H-SiC CMOS Technology enabling Smart Sensor Integration and Circuit Operation above 500 °C

Abstract
In order to provide an option for fabrication of high temperature sensing and circuit solutions, an accessible 4H-SiC high temperature CMOS technology was developed. A detailed overview of the fabrication process is given, with options for lateral power transistor integration, threshold voltage manipulation, optimization of interface state density, dedicated p-type ohmic contacts and two high temperature metallization layers. To prove high temperature device operation capability, device characteristics above 500 °C are presented. Examples include an inverter as a basic logic building block and a lateral power transistor with a blocking voltage of over 700 V. Finally, lateral integrated UV photodiodes based on a p-n junction are presented as a sensor application example. In collaboration with different partners, more complex integrated circuits and smart sensing solutions have also been realized and demonstrated previously, highlighting the possibilities if this technology.
Author(s)
May, Alexander  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Rommel, Mathias  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Baier, Leander  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Schraml, Michael
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Dick, Jan F.
Friedrich-Alexander-Universität Erlangen-Nürnberg  
Jank, Michael  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Schulze, Jörg
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Mainwork
Smart Systems Integration Conference and Exhibition, SSI 2024  
Conference
Smart Systems Integration Conference and Exhibition 2024  
DOI
10.1109/SSI63222.2024.10740550
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • CMOS

  • device fabrication

  • high temperature

  • ICs

  • LDMOS

  • sensors

  • SiC

  • technology platform

  • UV photodiode

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024