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  4. Laser direct imaging breaks new ground: Structuring of film thicknesses up to 20 µm for microelectronics
 
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September 16, 2024
Presentation
Title

Laser direct imaging breaks new ground: Structuring of film thicknesses up to 20 µm for microelectronics

Title Supplement
Presentation held at 50th International Micro and Nano Engineering Conference, MNE 2024, September, 16th - 19th, 2024, Montpellier, France
Author(s)
Ratajczak, Lynn
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Reinhardt, Kathrin  orcid-logo
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Körner, Stefan  
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Conference
International Conference on Micro- and Nano-Engineering 2024  
File(s)
Download (9.92 MB)
Rights
Use according to copyright law
DOI
10.24406/publica-3878
Language
English
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
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