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  4. Wide Bandwidth PCB Rogowski Coil Current Sensor with Droop Suppression and DC Restoration for In-Situ Inverter Measurements
 
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2024
Conference Paper
Title

Wide Bandwidth PCB Rogowski Coil Current Sensor with Droop Suppression and DC Restoration for In-Situ Inverter Measurements

Abstract
The use of wide-bandgap (WBG) semiconductor switches poses significant challenges for current measurement. To facilitate switch current measurement within the application, compact and high-bandwidth PCB-embedded Rogowski coil current sensors (RCCS) offer an effective solution. Previous approaches were subject to trade-offs between sensitivity and bandwidth in coil design as well as susceptibility to droop and parasitic offsets in the integrator design. In this paper, a rectangular coil design is optimized through FEM simulation for maximum bandwidth and sensitivity. An improved integrator concept is introduced to mitigate droop phenomena by enabling a low cutoff frequency, while preserving the signal DC component. A combination of active integration and self-integration through low-impedance termination enhances signal-to-noise ratio (SNR) for broadband measurements. The design is comprehensively validated. Initially, the frequency response is examined for the first time by monofrequent excitation ranging from 10 Hz to 75 MHz. Subsequently, the time-domain behavior is confirmed through measurements in double-pulse and buck converter setups.
Author(s)
Quergfelder, Simon  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Sax, Julian
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Heckel, Thomas  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Eckardt, Bernd  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
März, Martin  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Mainwork
CIPS 2024, 13th International Conference on Integrated Power Electronics Systems  
Conference
International Conference on Integrated Power Electronics Systems 2024  
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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