Sequential Manufacturing of Highly Functionalized 3-Dimensional Ceramic Components for Power Electronics

The central task in standard and power electronics is the processing of electronic information and the communication with higher-level systems. In general, this requires hardware that is adapted to the task. This consists of electronic components, often a subcarrier and a housing. In addition, there are always other functional, ecological, and economic constraints. For example, increased functional density can be achieved by a 3-dimensional arrangement of electronic components or housing components. An effective way of achieving this is the use of additive ceramic manufacturing processes in combination with functionalization of these components by thick-film technology.