Flexible eFPGA Based Demonstration Platform for Die-to-Die Interface Testing

Developers of high-performance chiplet-based solutions need a way to validate the interface compatibility of their chiplets. A new project has created a demonstration platform suitable for various applications such as radar preprocessing, wireless and optical communications, wireless infrastructure, ADAS, and high-performance test and measurement equipment. The platform employs eFPGAs to provide reconfigurability, allowing rapid changes and offering low latency and high-performance data acceleration. Developers can use it to explore chiplet-to-chiplet interconnects such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe). New versions of the protocols can also be readily incorporated.