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  4. Highly-Compact 20-mW, 270-320-GHz InGaAs mHEMT Power Amplifier MMIC
 
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2024
Conference Paper
Title

Highly-Compact 20-mW, 270-320-GHz InGaAs mHEMT Power Amplifier MMIC

Abstract
This paper describes a highly compact topology for InGaAs mHEMT based THz PA MMICs. In this context, a unique vertical DC bias distribution between the parallel common-source devices has been developed, allowing the separation of the matching-network design and bias-insertion-network design during the circuit development. As a proof of concept, a 6-stage power amplifier MMIC is reported, realized in a 35-nm InGaAs mHEMT technology. The PA MMIC achieves 20 dB of gain between 270 and 320 GHz and power levels larger than 20mW in the frequency range around 300GHz with an maximum PAE above 2.5 %.
Author(s)
John, Laurenz  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Tessmann, Axel  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Wagner, Sandrine  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Leuther, Arnulf  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Mainwork
IEEE/MTT-S International Microwave Symposium, IMS 2024  
Conference
International Microwave Symposium 2024  
DOI
10.1109/IMS40175.2024.10600274
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • InGaAs

  • mHEMTs

  • power amplifiers

  • THz

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