Novel rapid and deposition-free strategy for FIB cross-section preparation

In this work a novel focused ion beam (FIB) cross-section preparation method of "flying cube" is presented, which allows time savings of 60-85% of the time required for cross-section preparation compared to the standard processes applied so far. Furthermore, it enables high-quality cross sections even for samples with thick non-conductive or poorly conductive layers (e.g., photoresist, PMMA or SiO2) and samples with cavities or pronounced topographies. Thereby it gets along with no deposition of impurities on the wafer surface other than the sputtered and redeposited material. Due to the great flexibility, it is possible to extend the field of application beyond the field of electronics and semiconductors.