Ceramic Multilayer Technology as Integration Platform and Interposer Technology

This paper describes the further development of ceramic multilayer technology as a possible integration platform for the development of ceramic interposers as an alternative to silicon-based interposers and describes their advantages and disadvantages. To achieve the very small line structures of 10-20 µm, new structuring methods such as photo-imageable pastes (PI) [1] or maskless functional printing methods such as aerosol printing [2] or inkjet technology are being developed. The advantageous material properties of ceramics, such as high heat conductivities, semiconductor adapted thermomechanical expansion, hermetic density, stability under aggressive media and excellent high frequency performance, enable a long-term stable interposer solution. In combination with the multilayer technology LTCC (Low Temperature Cofired Ceramics), which is suitable for mass production, the production costs can be reduced compared to silicon interposer technology. Furthermore, the ceramic multilayer technology offers the possibility to integrate passive elements such as resistors, coils and capacitors directly into the interposer (Figure 1). As a result, no additional areas on the interposer are required for equipping such elements and the space requirements are reduced.