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  4. Integration of LTCC into Printed Circuit Boards for Trustworthy Electronics
 
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January 1, 2023
Conference Paper
Title

Integration of LTCC into Printed Circuit Boards for Trustworthy Electronics

Abstract
Sustainable and trustworthy applications gaining significance in electronics, a fast-growing industry itself. The integration of well-established robust materials, like low temperature cofired ceramics (LTCC), into printed circuit boards (PCB) can prolong lifetimes, enhance safety, and improve properties of the assemblies, e.g. RF applications. Thus, new safety elements are designed within the context of the project VE-CeraTrust.
Author(s)
Schroeter, Annett
VIA Electronic GmbH
Krieger, Uwe
VIA Electronic GmbH
Lehnberger, Christoph
Andus Electronic GmbH
Uhlig, Peter
IMST GmbH
Goldberg, Adrian  
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Mainwork
MikroSystemTechnik Kongress 2023  
Conference
MikroSystemTechnik Kongress 2023  
Language
English
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
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