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  4. A 4H-SiC CMOS SPICE Level 3 Model for Circuit Simulations
 
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2024
Journal Article
Title

A 4H-SiC CMOS SPICE Level 3 Model for Circuit Simulations

Abstract
In this paper, a compact DC SPICE model for 4H-SiC lateral metal oxide semiconductor field effect transistors is shown both for PMOSFET and NMOSFET. It is validated through experimental comparisons by varying channel sizes, temperature in the range between 298K and 573K, and body voltage conditions. A new model of the threshold voltage is introduced in order to take into account the effects of the high interface defects density. Finally, an inverter logic gate is simulated at different temperatures and compared with experimental data and with BSIM4SiC simulation outcomes, where a maximum logic threshold voltage error of 0.85% to the experimental data is shown compared to 6.78% of BSIM4SiC.
Author(s)
Rinaldi, Nicola
May, Alexander  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Rommel, Mathias  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Liguori, Rosalba
Rubino, Alfredo
Licciardo, Gian Domenico
Benedetto, Luigi Di
Journal
IEEE Electron Device Letters  
Open Access
DOI
10.1109/LED.2024.3412729
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • 4H-SiC CMOS technology

  • circuit simulation

  • Integrated circuit modeling

  • interface state density

  • Logic gates

  • MOSFET circuits

  • Semiconductor device modeling

  • SPICE

  • SPICE modeling

  • Temperature dependence

  • Temperature distribution

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