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  4. An analog to digital converter in a SiC CMOS technology for high-temperature applications
 
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2024
Journal Article
Title

An analog to digital converter in a SiC CMOS technology for high-temperature applications

Abstract
Integrated circuits based on wide bandgap semiconductors are considered an attractive option for meeting the demand for high-temperature electronics. Here, we report an analog-to-digital converter fabricated in a silicon carbide complementary metal-oxide-semiconductor technology now available through Europractice. The MOSFET component in this technology was measured up to 500 °C, and the key parameters, such as threshold voltage, field-effect mobility, and channel-length modulation parameters, were extracted. A 4-bit flash data converter, consisting of 266 transistors, is implemented with this technology and demonstrates correct operation up to 400 °C. Finally, the gate oxide quality is investigated by time-dependent dielectric breakdown measurements at 500 °C. A field-acceleration factor of 4.4 dec/(MV/cm) is obtained by applying the E model.
Author(s)
Mo, Jiarui
Niu, Yunfan
May, Alexander  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Rommel, Mathias  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Rossi, Chiara  orcid-logo
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Romijn, Joost
Zhang, Guoqi
Vollebregt, Sten
Journal
Applied Physics Letters  
Open Access
DOI
10.1063/5.0195013
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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