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June 16, 2024
Conference Paper
Title
Highly Flexible Dielectric Platform for Post-CMOS Photonics
Abstract
We present a photonic technological development service that includes an 8″ wafer-scale optical-lithography photonic platform customizable to application-specific needs. Our platform offers a choice of waveguide materials and deposition techniques. Low-temperature deposition techniques, in particular, allow for CMOS-compatibility and electronic-photonic co-integration (post-CMOS). We show results of experimental characterization of photonic waveguides and ring resonators fabricated in initial fabrication runs in silicon nitride (Si3N4 and SixNy) and tantalum pentoxide (Ta2O5) layers. The results of transmission measurements in the C-band and at visible wavelengths indicate that performance of our devices is on par with those of established players in the field.
Author(s)
Funding(s)
terahertz.NRW