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June 16, 2024
Conference Paper
Title

Highly Flexible Dielectric Platform for Post-CMOS Photonics

Abstract
We present a photonic technological development service that includes an 8″ wafer-scale optical-lithography photonic platform customizable to application-specific needs. Our platform offers a choice of waveguide materials and deposition techniques. Low-temperature deposition techniques, in particular, allow for CMOS-compatibility and electronic-photonic co-integration (post-CMOS). We show results of experimental characterization of photonic waveguides and ring resonators fabricated in initial fabrication runs in silicon nitride (Si3N4 and SixNy) and tantalum pentoxide (Ta2O5) layers. The results of transmission measurements in the C-band and at visible wavelengths indicate that performance of our devices is on par with those of established players in the field.
Author(s)
Westhues, Marcus Julius
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Geruschke, Thomas  
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Hauser, Julia
Burkard, Roman
Universität Duisburg-Essen, EBS
Nesic, Aleksandar
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Schall-Giesecke, Anna Lena  orcid-logo
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Mainwork
The 25th European Conference on Integrated Optics  
Funding(s)
terahertz.NRW
Conference
European Conference on Integrated Optics 2024  
DOI
10.1007/978-3-031-63378-2_96
Language
English
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
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